Key facts
Production status: Active
Release date: 2023
Cores / Threads: 4 / 8
Base clock: 3200 MHz
Turbo clock: 4200 MHz
TDP: -
Process: 6 nm
Codename: Rembrandt-R
Generation: Ryzen 5 (Zen 3+ (Rembrandt))
All available specs
| Field | Value |
|---|---|
| name | Ryzen 5 7235HS |
| Socket | AMD Socket FP7 |
| Foundry | TSMC |
| Process Size | 6 nm |
| Die Size | 210 mm² |
| Package | FP7r2 |
| Market | Mobile |
| Production Status | Active |
| Release Date | 2023 |
| Part# | 100-000001507 |
| Frequency | 3.2 GHz |
| Turbo Clock | up to 4.2 GHz |
| Base Clock | 100 MHz |
| Multiplier | 32.0x |
| Multiplier Unlocked | No |
| Codename | Rembrandt-R |
| Generation | Ryzen 5 (Zen 3+ (Rembrandt)) |
| Memory Support | DDR5 |
| ECC Memory | Yes |
| # of Cores | 4 |
| # of Threads | 8 |
| SMP # CPUs | 1 |
| Integrated Graphics | Radeon 660M |
| Cache L1 | 64 KB (per core) |
| Cache L2 | 512 KB (per core) |
| Features | MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AES, AVX, AVX2, BMI1, BMI2, SHA, F16C, FMA3, NX-Bit, AMD64, EVP, AMD-V, SMAP, SMEP, SMT, Precision Boost 2 |
| Notes | Radeon Graphics disabled.DRAM ECC requires platform support to function. |
| Rated Speed | 4800 MT/s |
| Memory Bus | Dual-channel |
| Memory Bandwidth | 76.8 GB/s |
| tJMax | 95°C |
| PCI-Express | Gen 4, 20 Lanes (CPU only) |
| Cache L3 | 8 MB (shared) |
| Configurable TDP | 35-54 W |